Printed Circuit Board Division
Strength of TANAZAWA HAKKOSHA
Capable with integrated support from circuit design / prototype to tool-building then mass-production. It is rare in single-sided industry. “Quality First” is our top priority in manufacturing. Always striving to comply with standards, our quality improvement system, and provide a higher level of satisfaction to all our customers.
- P.C.B. of TANAZAWA HAKKOSHA
- Well experienced and many achievements such as; High-mix low-volume, repair use (long term storage), changing from double to single-sided. Pattern design is proposed considering mass production in mind, dedicated production line matching volume and specifications (printing method / photography method); which will contribute for your cost-reduction.
P.C.B. Mass-production
Printing method achieves low costs
Photographic method meets the needs of high-density products
Double-sided (Non-through-hole, Copper through-hole), Single-sided, Thin board (0.1t-), Solder leveling, Plated board (Au, Ni, Pd), For 0603-chips,
Aluminum, Copper-based (210um copper), Flexible, Eyelets, Carbon, Peelable solder-masked
Prototyping P.C.B. /
Spare P.C.B.
- Rapid prototyping
- Particularly good at analog single-sided
- Circuit board for prototype: Single-sided / Cu t-h / Ag t-h / Non t-h / Flexible / Al / Multilayer / Thick Cu / mounting
- Spare P.C.B. : bulk production and long-term storage / by-case production / copy from actual item (scanning the actual item >> creating data >> making P.C.B.)
Short lead-time
- Express Service
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- Single-sided: Data receipt at 9:00 A.M. → shipping same day
- Double-sided: Data receipt at 9:00 A.M. → shipping next day
- Super Express Service
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- Single-sided: Data receipt at 2:00 P.M. → shipping same day
Worry-free quality management / Reliability test
- ISO Certification
- ISO9001 updated to 2015 edition /
ISO14001 updated to 2015 edition
Reliability testing/analysis
Through-hole lifetime testing, accelerated lifetime testing, voltage duration testing, Moisture resistant time/humid load testing, high-temp. time testing, solder cracking testing, measurement on coated membrane, surface/sectional observation, dimension measurement, warpage/flatness measurement.
